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Chemical content 1PS76SB21-Q

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Type numberPackagePackage descriptionTotal product weight
1PS76SB21-QSOD323SOD24.16831 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663893145112601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
934663893115112601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07000100.000001.67934
subTotal0.07000100.000001.67934
Lead FrameCopper alloyCopper (Cu)7440-50-81.2165195.0400029.18478
Iron (Fe)7439-89-60.032642.550000.78305
Lead (Pb)7439-92-10.000380.030000.00921
Phosphorus (P)7723-14-00.001920.150000.04606
Zinc (Zn)7440-66-60.002560.200000.06142
Pure metal layerSilver (Ag)7440-22-40.025982.030000.62337
subTotal1.28000100.0000030.70789
Mould CompoundFillerSilica fused60676-86-02.0137375.1000048.31057
PigmentCarbon black1333-86-40.008040.300000.19298
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4692517.5000011.25746
Phenol Formaldehyde resin (generic)9003-35-40.190387.100004.56731
subTotal2.68140100.0000064.32832
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00014
Non hazardousProprietary0.000070.055500.00178
Tin solderTin (Sn)7440-31-50.1332599.940003.19684
subTotal0.13333100.000003.19876
WirePure metalCopper (Cu)7440-50-80.00358100.000000.08579
subTotal0.00358100.000000.08579
total4.16831100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.