Chemical content 2PA1774SM

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Type numberPackagePackage descriptionTotal product weight
2PA1774SMSOT883 dummy POVXQFN30.85561 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93405714431515126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.88826
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.12237
Phenolic resinProprietary0.0013513.530000.15813
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.50627
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100046.94464
Magnesium (Mg)7439-95-40.000630.146000.07337
Nickel (Ni)7440-02-00.012532.913001.46397
Silicon (Si)7440-21-30.002710.631000.31712
MetallisationGold (Au)7440-57-50.000150.035000.01759
Nickel (Ni)7440-02-00.011852.755001.38457
Palladium (Pd)7440-05-30.000470.110000.05528
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.94612
Silica fused60676-86-00.2220060.0000025.94640
Flame retardantMetal hydroxideProprietary0.011103.000001.29732
ImpurityBismuth (Bi)7440-69-90.001850.500000.21622
PigmentCarbon black1333-86-40.001850.500000.21622
PolymerEpoxy resin systemProprietary0.025907.000003.02708
Phenolic resinProprietary0.022206.000002.59464
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00065
Tin solderTin (Sn)7440-31-50.0099999.940001.16806
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0056199.990000.65584
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.