Chemical content 2PD2150

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Type number	Package	Package description	Total product weight
2PD2150	SOT89	MPT3	40.91081 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934059292115	15	1	260		1	235			D-22529 HAMBURG, Germany; Dongguan, China

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	0.08470	77.00000	0.20704
	Polymer	Resin system	Proprietary	0.02530	23.00000	0.06184
		subTotal		0.11000	100.00000	0.26888

Die	Doped silicon	Silicon (Si)	7440-21-3	0.44000	100.00000	1.07551
		subTotal		0.44000	100.00000	1.07551

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	17.24580	99.00000	42.15463
		Iron (Fe)	7439-89-6	0.01742	0.10000	0.04258
		Phosphorus (P)	7723-14-0	0.00523	0.03000	0.01277
	Pure metal layer	Silver (Ag)	7440-22-4	0.15155	0.87000	0.37045
		subTotal		17.42000	100.00000	42.58043

Mould Compound	Additive	Non hazardous	Proprietary	0.66033	2.90000	1.61407
		Triphenylphosphine	603-35-0	0.01138	0.05000	0.02783
	Filler	Silica -amorphous-	7631-86-9	16.39440	72.00000	40.07352
	Pigment	Carbon black	1333-86-4	0.01138	0.05000	0.02783
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	3.41550	15.00000	8.34865
		Phenol Formaldehyde resin (generic)	9003-35-4	2.27700	10.00000	5.56577
		subTotal		22.77000	100.00000	55.65767

Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.00000	0.00450	0.00001
		Non hazardous	Proprietary	0.00004	0.05550	0.00009
	Tin solder	Tin (Sn)	7440-31-5	0.06996	99.94000	0.17100
		subTotal		0.07000	100.00000	0.17110

Wire	Pure metal	Gold (Au)	7440-57-5	0.10081	100.00000	0.24642
		subTotal		0.10081	100.00000	0.24642

		total		40.91081	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.