Chemical content 2PD2150

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Type numberPackagePackage descriptionTotal product weight
2PD2150SOT89MPT340.91081 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93405929211515126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0847077.000000.20704
PolymerResin systemProprietary0.0253023.000000.06184
DieDoped siliconSilicon (Si)7440-21-30.44000100.000001.07551
Lead FrameCopper alloyCopper (Cu)7440-50-817.2458099.0000042.15463
Iron (Fe)7439-89-60.017420.100000.04258
Phosphorus (P)7723-14-00.005230.030000.01277
Pure metal layerSilver (Ag)7440-22-40.151550.870000.37045
Mould CompoundAdditiveNon hazardousProprietary0.660332.900001.61407
FillerSilica -amorphous-7631-86-916.3944072.0000040.07352
PigmentCarbon black1333-86-40.011380.050000.02783
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.4155015.000008.34865
Phenol Formaldehyde resin (generic)9003-35-42.2770010.000005.56577
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00001
Non hazardousProprietary0.000040.055500.00009
Tin solderTin (Sn)7440-31-50.0699699.940000.17100
WirePure metalGold (Au)7440-57-50.10081100.000000.24642
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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