Chemical content 74ABT08PW

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Type numberPackagePackage descriptionTotal product weight
74ABT08PWSOT402-1TSSOP1456.32857 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352071001181212601235Bangkok, Thailand; D-22529 HAMBURG, Germany; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.5126480.100000.91009
PolymerResin systemProprietary0.1273619.900000.22610
DieDoped siliconSilicon (Si)7440-21-30.34178100.000000.60675
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-820.4687097.4700036.33804
Iron (Fe)7439-89-60.504002.400000.89475
Phosphorus (P)7723-14-00.006300.030000.01118
Zinc (Zn)7440-66-60.021000.100000.03728
Mould CompoundAdditiveNon hazardousProprietary1.593304.700002.82858
FillerSilica fused60676-86-026.7810079.0000047.54426
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.034006.000003.61096
PigmentCarbon black1333-86-40.067800.200000.12037
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.356004.000002.40730
Non hazardousProprietary1.389904.100002.46749
Tetramethylbiphenyl diglycidyl ether85954-11-60.678002.000001.20365
Pre-PlatingPure metal layerGold (Au)7440-57-50.003501.000000.00621
Nickel (Ni)7440-02-00.3395097.000000.60271
Palladium (Pd)7440-05-30.007002.000000.01243
WirePure metalCopper (Cu)7440-50-80.09679100.000000.17183
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.