Chemical content 74ABT16240ADGG

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Type numberPackagePackage descriptionTotal product weight
74ABT16240ADGGSOT362-1TSSOP48204.24321 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352122101181112601235Bangkok, Thailand; D-22529 HAMBURG, Germany; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2259177.900000.11061
PolymerAcrylic resinProprietary0.0440815.200000.02158
Resin systemProprietary0.020016.900000.00980
DieDoped siliconSilicon (Si)7440-21-31.12943100.000000.55299
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-876.6494097.0000037.52849
Nickel (Ni)7440-02-02.370603.000001.16068
Mould CompoundFillerSilica -amorphous-7631-86-90.732000.600000.35840
Silica fused60676-86-095.5626078.3300046.78863
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-87.442006.100003.64370
PigmentCarbon black1333-86-40.244000.200000.11947
PolymerEpoxy resin systemProprietary10.811648.862005.29351
Phenolic resinProprietary7.207765.908003.52901
Pre-PlatingPure metal layerGold (Au)7440-57-50.015101.000000.00739
Nickel (Ni)7440-02-01.4647097.000000.71714
Palladium (Pd)7440-05-30.030202.000000.01479
WirePure metalCopper (Cu)7440-50-80.29378100.000000.14384
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.