Chemical content 74ABT32D

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Type numberPackagePackage descriptionTotal product weight
74ABT32DSOT108-1SO14124.23009 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352087001181512601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.6408080.100000.51582
PolymerResin systemProprietary0.1592019.900000.12815
DieDoped siliconSilicon (Si)7440-21-30.34178100.000000.27512
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.5653697.4700038.28812
Iron (Fe)7439-89-61.171202.400000.94277
Phosphorus (P)7723-14-00.014640.030000.01178
Zinc (Zn)7440-66-60.048800.100000.03928
Mould CompoundAdditiveNon hazardousProprietary3.478004.700002.79964
FillerSilica fused60676-86-058.4600079.0000047.05784
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.440006.000003.57401
PigmentCarbon black1333-86-40.148000.200000.11913
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.960004.000002.38268
Non hazardousProprietary3.034004.100002.44224
Tetramethylbiphenyl diglycidyl ether85954-11-61.480002.000001.19134
Pre-PlatingPure metal layerGold (Au)7440-57-50.002001.000000.00161
Nickel (Ni)7440-02-00.1940097.000000.15616
Palladium (Pd)7440-05-30.004002.000000.00322
WirePure metalCopper (Cu)7440-50-80.08831100.000000.07109
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.