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Chemical content 74ABTH162245ADGG

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Type numberPackagePackage descriptionTotal product weight
74ABTH162245ADGGSOT362-1TSSOP48204.56044 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352288901181112601235Bangkok, Thailand; D-22529 HAMBURG, Germany; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2259177.900000.11044
PolymerAcrylic resinProprietary0.0440815.200000.02155
Resin systemProprietary0.020016.900000.00978
subTotal0.29000100.000000.14177
DieDoped siliconSilicon (Si)7440-21-31.47209100.000000.71964
subTotal1.47209100.000000.71964
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-876.6494097.0000037.47029
Nickel (Ni)7440-02-02.370603.000001.15888
subTotal79.02000100.0000038.62917
Mould CompoundAdditiveNon hazardousProprietary5.734004.700002.80308
FillerSilica fused60676-86-096.3800079.0000047.11566
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-87.320006.000003.57840
PigmentCarbon black1333-86-40.244000.200000.11928
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.880004.000002.38560
Non hazardousProprietary5.002004.100002.44524
Tetramethylbiphenyl diglycidyl ether85954-11-62.440002.000001.19280
subTotal122.00000100.0000059.64006
Pre-PlatingPure metal layerGold (Au)7440-57-50.015101.000000.00738
Nickel (Ni)7440-02-01.4647097.000000.71602
Palladium (Pd)7440-05-30.030202.000000.01476
subTotal1.51000100.000000.73816
WirePure metalCopper (Cu)7440-50-80.26835100.000000.13118
subTotal0.26835100.000000.13118
total204.56044100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.