Chemical content 74AHC125D

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Type numberPackagePackage descriptionTotal product weight
74AHC125DSOT108-1SO14136.09931 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352627621181812601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.47135
PolymerResin systemProprietary0.4975019.900000.36554
DieDoped siliconSilicon (Si)7440-21-30.21155100.000000.15543
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-863.3555097.4700046.55093
Iron (Fe)7439-89-61.560002.400001.14622
Phosphorus (P)7723-14-00.019500.030000.01433
Zinc (Zn)7440-66-60.065000.100000.04776
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.34829
FillerSilica fused60676-86-053.7200079.0000039.47118
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.99781
PigmentCarbon black1333-86-40.136000.200000.09993
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.99854
Non hazardousProprietary2.788004.100002.04850
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.99927
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00220
Nickel (Ni)7440-02-00.2910097.000000.21381
Palladium (Pd)7440-05-30.006002.000000.00441
WirePure metalCopper (Cu)7440-50-80.08776100.000000.06449
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.