Chemical content 74AHC132PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC132PW-Q100SOT402-1TSSOP1456.00342 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935302484118612601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4985677.900000.89023
PolymerAcrylic resinProprietary0.0972815.200000.17370
Resin systemProprietary0.044166.900000.07885
DieDoped siliconSilicon (Si)7440-21-30.39829100.000000.71119
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-820.4687097.4700036.54902
Iron (Fe)7439-89-60.504002.400000.89995
Phosphorus (P)7723-14-00.006300.030000.01125
Zinc (Zn)7440-66-60.021000.100000.03750
Mould CompoundAdditiveNon hazardousProprietary1.584374.700002.82906
FillerSilica fused60676-86-026.6309079.0000047.55227
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.022606.000003.61157
PigmentCarbon black1333-86-40.067420.200000.12039
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.348404.000002.40771
Non hazardousProprietary1.382114.100002.46790
Tetramethylbiphenyl diglycidyl ether85954-11-60.674202.000001.20386
Pre-PlatingPure metal layerGold (Au)7440-57-50.005103.000000.00911
Nickel (Ni)7440-02-00.1569192.300000.28018
Palladium (Pd)7440-05-30.005273.100000.00941
Silver (Ag)7440-22-40.002721.600000.00486
WirePure metalCopper (Cu)7440-50-80.08513100.000000.15201
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.