Chemical content 74AHC139PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC139PW-Q100SOT403-1TSSOP1667.27896 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300677118612601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.3895077.900000.57893
PolymerAcrylic resinProprietary0.0760015.200000.11296
Resin systemProprietary0.034506.900000.05128
DieDoped siliconSilicon (Si)7440-21-30.55407100.000000.82354
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700055.05228
Iron (Fe)7439-89-60.912002.400001.35555
Phosphorus (P)7723-14-00.011400.030000.01694
Zinc (Zn)7440-66-60.038000.100000.05648
Mould CompoundAdditiveNon hazardousProprietary1.251094.700001.85956
FillerSilica fused60676-86-021.0290179.0000031.25644
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.597146.000002.37391
PigmentCarbon black1333-86-40.053240.200000.07913
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.064764.000001.58260
Non hazardousProprietary1.091384.100001.62217
Tetramethylbiphenyl diglycidyl ether85954-11-60.532382.000000.79130
Pre-PlatingPure metal layerGold (Au)7440-57-50.045003.000000.06689
Nickel (Ni)7440-02-01.3845092.300002.05785
Palladium (Pd)7440-05-30.046503.100000.06912
Silver (Ag)7440-22-40.024001.600000.03567
WirePure metalCopper (Cu)7440-50-80.10589100.000000.15739
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.