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Chemical content 74AHC157D

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Type numberPackagePackage descriptionTotal product weight
74AHC157DSOT109-1SO16143.15983 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352639981181512601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01632
PolymerAcrylic resinProprietary0.0045615.200000.00319
Resin systemProprietary0.002076.900000.00145
subTotal0.03000100.000000.02096
DieDoped siliconSilicon (Si)7440-21-30.49869100.000000.34835
subTotal0.49869100.000000.34835
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-836.7218297.4700025.65093
Iron (Fe)7439-89-60.904202.400000.63160
Phosphorus (P)7723-14-00.011300.030000.00790
Zinc (Zn)7440-66-60.037680.100000.02632
subTotal37.67500100.0000026.31675
Mould CompoundAdditiveNon hazardousProprietary4.900694.700003.42323
FillerSilica fused60676-86-082.3733079.0000057.53939
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.256206.000004.37008
PigmentCarbon black1333-86-40.208540.200000.14567
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.170804.000002.91339
Non hazardousProprietary4.275074.100002.98622
Tetramethylbiphenyl diglycidyl ether85954-11-62.085402.000001.45669
subTotal104.27000100.0000072.83467
Pre-PlatingPure metal layerGold (Au)7440-57-50.005651.000000.00395
Nickel (Ni)7440-02-00.5480597.000000.38282
Palladium (Pd)7440-05-30.011302.000000.00789
subTotal0.56500100.000000.39466
WirePure metalCopper (Cu)7440-50-80.12114100.000000.08462
subTotal0.12114100.000000.08462
total143.15983100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.