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Chemical content 74AHC157PW

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Type numberPackagePackage descriptionTotal product weight
74AHC157PWSOT403-1TSSOP1653.00380 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352639991181412601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.22046
PolymerAcrylic resinProprietary0.0228015.200000.04302
Resin systemProprietary0.010356.900000.01953
subTotal0.15000100.000000.28301
DieDoped siliconSilicon (Si)7440-21-30.35621100.000000.67205
subTotal0.35621100.000000.67205
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.53245
Iron (Fe)7439-89-60.489842.400000.92416
Phosphorus (P)7723-14-00.006120.030000.01155
Zinc (Zn)7440-66-60.020410.100000.03851
subTotal20.41000100.0000038.50667
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.80916
FillerSilica fused60676-86-025.0272079.0000047.21775
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.58616
PigmentCarbon black1333-86-40.063360.200000.11954
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.39077
Non hazardousProprietary1.298884.100002.45054
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.19539
subTotal31.68000100.0000059.76931
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00566
Nickel (Ni)7440-02-00.2910097.000000.54902
Palladium (Pd)7440-05-30.006002.000000.01132
subTotal0.30000100.000000.56600
WirePure metalCopper (Cu)7440-50-80.10759100.000000.20299
subTotal0.10759100.000000.20299
total53.00380100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.