Chemical content 74AHC164D-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC164D-Q100SOT108-1SO14141.71798 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301199118912601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01649
PolymerAcrylic resinProprietary0.0045615.200000.00322
Resin systemProprietary0.002076.900000.00146
DieDoped siliconSilicon (Si)7440-21-30.29232100.000000.20627
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.69229
Iron (Fe)7439-89-61.175702.400000.82960
Phosphorus (P)7723-14-00.014700.030000.01037
Zinc (Zn)7440-66-60.048990.100000.03457
Mould CompoundAdditiveNon hazardousProprietary4.280974.700003.02077
FillerSilica fused60676-86-071.9567679.0000050.77461
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.465076.000003.85630
PigmentCarbon black1333-86-40.182170.200000.12854
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.643384.000002.57087
Non hazardousProprietary3.734464.100002.63514
Tetramethylbiphenyl diglycidyl ether85954-11-61.821692.000001.28543
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02632
Nickel (Ni)7440-02-01.1477892.300000.80990
Palladium (Pd)7440-05-30.038553.100000.02720
Silver (Ag)7440-22-40.019901.600000.01404
WirePure metalCopper (Cu)7440-50-80.08021100.000000.05660
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.