Chemical content 74AHC164PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC164PW-Q100SOT402-1TSSOP1459.75366 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301372118812601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.02607
PolymerAcrylic resinProprietary0.0030415.200000.00509
Resin systemProprietary0.001386.900000.00231
DieDoped siliconSilicon (Si)7440-21-30.29232100.000000.48921
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.7809297.4700031.43058
Iron (Fe)7439-89-60.462442.400000.77391
Phosphorus (P)7723-14-00.005780.030000.00967
Zinc (Zn)7440-66-60.019270.100000.03225
Mould CompoundAdditiveNon hazardousProprietary1.861204.700003.11479
FillerSilica fused60676-86-031.2840079.0000052.35495
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.376006.000003.97633
PigmentCarbon black1333-86-40.079200.200000.13254
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.584004.000002.65088
Non hazardousProprietary1.623604.100002.71716
Tetramethylbiphenyl diglycidyl ether85954-11-60.792002.000001.32544
Pre-PlatingPure metal layerGold (Au)7440-57-50.014673.000000.02456
Nickel (Ni)7440-02-00.4514692.300000.75553
Palladium (Pd)7440-05-30.015163.100000.02538
Silver (Ag)7440-22-40.007831.600000.01310
WirePure metalCopper (Cu)7440-50-80.08381100.000000.14026
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.