Chemical content 74AHC1G00GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC1G00GW-Q100SOT353-1UMT55.67418 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300692125712601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12848
PolymerResin systemProprietary0.0024325.000000.04283
DieDoped siliconSilicon (Si)7440-21-30.08038100.000001.41668
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.62156
Iron (Fe)7439-89-60.045512.310000.80200
Lead (Pb)7439-92-10.000200.010000.00347
Phosphorus (P)7723-14-00.001380.070000.02430
Zinc (Zn)7440-66-60.002360.120000.04166
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22567
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.11747
Silica fused60676-86-02.3217570.5700040.91786
PigmentCarbon black1333-86-40.006580.200000.11596
PolymerEpoxy resin systemProprietary0.305649.290005.38652
Phenolic resinProprietary0.195435.940003.44413
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.46280
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0140799.990000.24794
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.