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Chemical content 74AHC1G07GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC1G07GW-Q100SOT353-1UMT55.65642 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935305306125612601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12888
PolymerResin systemProprietary0.0024325.000000.04296
subTotal0.00972100.000000.17184
DieDoped siliconSilicon (Si)7440-21-30.06536100.000001.15544
subTotal0.06536100.000001.15544
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.72713
Iron (Fe)7439-89-60.045512.310000.80452
Lead (Pb)7439-92-10.000200.010000.00348
Phosphorus (P)7723-14-00.001380.070000.02438
Zinc (Zn)7440-66-60.002360.120000.04179
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22638
subTotal1.97000100.0000034.82768
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.14296
Silica fused60676-86-02.3217570.5700041.04633
PigmentCarbon black1333-86-40.006580.200000.11633
PolymerEpoxy resin systemProprietary0.5010715.230008.85838
subTotal3.29000100.0000058.16400
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.47995
subTotal0.31000100.000005.48048
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0113599.990000.20061
subTotal0.01135100.000000.20063
total5.65642100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.