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Chemical content 74AHC1G125GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC1G125GW-Q100SOT353-1UMT55.66723 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299236125612601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12863
PolymerResin systemProprietary0.0024325.000000.04288
subTotal0.00972100.000000.17151
DieDoped siliconSilicon (Si)7440-21-30.07360100.000001.29878
subTotal0.07360100.000001.29878
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.66279
Iron (Fe)7439-89-60.045512.310000.80298
Lead (Pb)7439-92-10.000200.010000.00348
Phosphorus (P)7723-14-00.001380.070000.02433
Zinc (Zn)7440-66-60.002360.120000.04171
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22595
subTotal1.97000100.0000034.76124
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.12743
Silica fused60676-86-02.3217570.5700040.96804
PigmentCarbon black1333-86-40.006580.200000.11611
PolymerEpoxy resin systemProprietary0.5010715.230008.84148
subTotal3.29000100.0000058.05306
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.46950
subTotal0.31000100.000005.47003
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0139099.990000.24528
subTotal0.01390100.000000.24530
total5.66723100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.