Chemical content 74AHC1G125GW

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Type numberPackagePackage descriptionTotal product weight
74AHC1G125GWSOT353-1UMT55.48562 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352630021251812601235Hsin-chu, Taiwan; Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.13289
PolymerResin systemProprietary0.0024325.000000.04430
DieDoped siliconSilicon (Si)7440-21-30.07360100.000001.34178
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400034.77725
Iron (Fe)7439-89-60.045512.310000.82957
Lead (Pb)7439-92-10.000200.010000.00359
Phosphorus (P)7723-14-00.001380.070000.02514
Zinc (Zn)7440-66-60.002360.120000.04309
Pure metal layerSilver (Ag)7440-22-40.012800.650000.23343
Mould CompoundFillerSilica -amorphous-7631-86-91.0906835.0700019.88247
Silica fused60676-86-01.3634243.8400024.85451
PigmentCarbon black1333-86-40.007780.250000.14173
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.3110010.000005.66937
Phenol Formaldehyde resin (generic)9003-35-40.309139.940005.63535
Polyethylene (PE) -wax-9002-88-40.027990.900000.51024
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00017
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00028
Tin solderTin (Sn)7440-31-50.3099799.990005.65057
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0123099.990000.22416
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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