Chemical content 74AHC1G4208GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC1G4208GW-Q100SOT353-1UMT55.68919 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935690951125312601235Bangkok, Thailand; Seremban, Malaysia; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12814
PolymerResin systemProprietary0.0024325.000000.04271
DieDoped siliconSilicon (Si)7440-21-30.09278100.000001.63082
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.53286
Iron (Fe)7439-89-60.045512.310000.79989
Lead (Pb)7439-92-10.000200.010000.00346
Phosphorus (P)7723-14-00.001380.070000.02424
Zinc (Zn)7440-66-60.002360.120000.04155
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22508
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.09606
Silica fused60676-86-02.3217570.5700040.80990
PigmentCarbon black1333-86-40.006580.200000.11566
PolymerEpoxy resin systemProprietary0.5010715.230008.80735
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.44839
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0166999.990000.29330
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.