Chemical content 74AHC244D

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Type numberPackagePackage descriptionTotal product weight
74AHC244DSOT163-1SO20520.75979 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352620011181312601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-43.4821377.900000.66866
PolymerAcrylic resinProprietary0.6794415.200000.13047
Resin systemProprietary0.308436.900000.05923
DieDoped siliconSilicon (Si)7440-21-30.47535100.000000.09128
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8152.5600497.4700029.29567
Iron (Fe)7439-89-63.756482.400000.72135
Phosphorus (P)7723-14-00.046960.030000.00902
Zinc (Zn)7440-66-60.156520.100000.03006
Mould CompoundAdditiveNon hazardousProprietary16.846214.700003.23493
FillerSilica fused60676-86-0283.1597079.0000054.37434
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-821.505806.000004.12970
PigmentCarbon black1333-86-40.716860.200000.13766
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-614.337204.000002.75313
Non hazardousProprietary14.695634.100002.82196
Tetramethylbiphenyl diglycidyl ether85954-11-67.168602.000001.37657
Pre-PlatingPure metal layerGold (Au)7440-57-50.019503.000000.00374
Nickel (Ni)7440-02-00.5999592.300000.11521
Palladium (Pd)7440-05-30.020153.100000.00387
Silver (Ag)7440-22-40.010401.600000.00200
WirePure metalCopper (Cu)7440-50-80.21444100.000000.04118
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.