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Chemical content 74AHC244PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC244PW-Q100SOT360-1TSSOP2083.33829 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298435118812601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.03739
PolymerAcrylic resinProprietary0.0060815.200000.00730
Resin systemProprietary0.002766.900000.00331
subTotal0.04000100.000000.04800
DieDoped siliconSilicon (Si)7440-21-30.33954100.000000.40742
subTotal0.33954100.000000.40742
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.7946697.4700035.75146
Iron (Fe)7439-89-60.733632.400000.88031
Phosphorus (P)7723-14-00.009170.030000.01100
Zinc (Zn)7440-66-60.030570.100000.03668
subTotal30.56803100.0000036.67945
Mould CompoundAdditiveNon hazardousProprietary2.419564.700002.90330
FillerSilica fused60676-86-040.6692079.0000048.80014
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.088806.000003.70634
PigmentCarbon black1333-86-40.102960.200000.12354
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.059204.000002.47089
Non hazardousProprietary2.110684.100002.53267
Tetramethylbiphenyl diglycidyl ether85954-11-61.029602.000001.23545
subTotal51.48000100.0000061.77233
Pre-PlatingPure metal layerGold (Au)7440-57-50.023283.000000.02793
Nickel (Ni)7440-02-00.7162192.300000.85940
Palladium (Pd)7440-05-30.024053.100000.02886
Silver (Ag)7440-22-40.012421.600000.01490
subTotal0.77596100.000000.93109
WirePure metalCopper (Cu)7440-50-80.13476100.000000.16170
subTotal0.13476100.000000.16170
total83.33829100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.