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Chemical content 74AHC245BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC245BQ-Q100SOT764-1DHVQFN2027.56291 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300184115412601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0961280.100000.34873
PolymerResin systemProprietary0.0238819.900000.08664
subTotal0.12000100.000000.43537
DieDoped siliconSilicon (Si)7440-21-30.69828100.000002.53340
subTotal0.69828100.000002.53340
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-89.8347297.4700035.68100
Iron (Fe)7439-89-60.242162.400000.87857
Phosphorus (P)7723-14-00.003030.030000.01098
Zinc (Zn)7440-66-60.010090.100000.03661
subTotal10.09000100.0000036.60716
Mould CompoundFillerSilica -amorphous-7631-86-91.295957.980004.70180
Silica fused60676-86-013.0069480.0920047.19001
PigmentCarbon black1333-86-40.150710.928000.54678
PolymerEpoxy resin systemProprietary1.372288.450004.97872
Phenolic resinProprietary0.414122.550001.50245
subTotal16.24000100.0000058.91976
Pre-PlatingPure metal layerGold (Au)7440-57-50.010503.000000.03809
Nickel (Ni)7440-02-00.3230592.300001.17205
Palladium (Pd)7440-05-30.010853.100000.03936
Silver (Ag)7440-22-40.005601.600000.02032
subTotal0.35000100.000001.26982
WirePure metalCopper (Cu)7440-50-80.06463100.000000.23450
subTotal0.06463100.000000.23450
total27.56291100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.