Chemical content 74AHC257PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC257PW-Q100SOT403-1TSSOP1660.41272 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300736118612601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21921
PolymerAcrylic resinProprietary0.0258415.200000.04277
Resin systemProprietary0.011736.900000.01942
DieDoped siliconSilicon (Si)7440-21-30.20932100.000000.34648
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.96872
Iron (Fe)7439-89-60.475552.400000.78716
Phosphorus (P)7723-14-00.005940.030000.00984
Zinc (Zn)7440-66-60.019810.100000.03280
Mould CompoundAdditiveNon hazardousProprietary1.861204.700003.08081
FillerSilica fused60676-86-031.2840079.0000051.78380
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.376006.000003.93295
PigmentCarbon black1333-86-40.079200.200000.13110
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.584004.000002.62196
Non hazardousProprietary1.623604.100002.68751
Tetramethylbiphenyl diglycidyl ether85954-11-60.792002.000001.31098
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02498
Nickel (Ni)7440-02-00.4642592.300000.76846
Palladium (Pd)7440-05-30.015593.100000.02581
Silver (Ag)7440-22-40.008051.600000.01332
WirePure metalCopper (Cu)7440-50-80.11595100.000000.19193
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.