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Chemical content 74AHC257PW

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Type numberPackagePackage descriptionTotal product weight
74AHC257PWSOT403-1TSSOP1652.86526 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352654681181112601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.22103
PolymerAcrylic resinProprietary0.0228015.200000.04313
Resin systemProprietary0.010356.900000.01958
subTotal0.15000100.000000.28374
DieDoped siliconSilicon (Si)7440-21-30.20932100.000000.39594
subTotal0.20932100.000000.39594
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.63081
Iron (Fe)7439-89-60.489842.400000.92658
Phosphorus (P)7723-14-00.006120.030000.01158
Zinc (Zn)7440-66-60.020410.100000.03861
subTotal20.41000100.0000038.60758
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.81652
FillerSilica fused60676-86-025.0272079.0000047.34149
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.59556
PigmentCarbon black1333-86-40.063360.200000.11985
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.39704
Non hazardousProprietary1.298884.100002.45696
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.19852
subTotal31.68000100.0000059.92594
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00567
Nickel (Ni)7440-02-00.2910097.000000.55046
Palladium (Pd)7440-05-30.006002.000000.01135
subTotal0.30000100.000000.56748
WirePure metalCopper (Cu)7440-50-80.11595100.000000.21933
subTotal0.11595100.000000.21933
total52.86526100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.