Chemical content 74AHC2G08DC

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Type numberPackagePackage descriptionTotal product weight
74AHC2G08DCSOT765-1VSSOP89.97756 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352751251251212601235Ayutthaya, Thailand; Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28772
PolymerResin systemProprietary0.0071319.900000.07148
DieDoped siliconSilicon (Si)7440-21-30.12590100.000001.26185
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.06194
Nickel (Ni)7440-02-00.105113.000001.05346
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.91222
FillerSilica fused60676-86-04.8840279.0000048.95001
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.71772
PigmentCarbon black1333-86-40.012360.200000.12392
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.47848
Non hazardousProprietary0.253474.100002.54044
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.23924
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03095
Nickel (Ni)7440-02-00.0950292.300000.95237
Palladium (Pd)7440-05-30.003193.100000.03199
Silver (Ag)7440-22-40.001651.600000.01651
WirePure metalCopper (Cu)7440-50-80.02691100.000000.26971
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.