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Chemical content 74AHC2G126DC-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC2G126DC-Q100SOT765-1VSSOP89.97425 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300743125712601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China; Ayutthaya, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28782
PolymerResin systemProprietary0.0071319.900000.07151
subTotal0.03584100.000000.35933
DieDoped siliconSilicon (Si)7440-21-30.12318100.000001.23493
subTotal0.12318100.000001.23493
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.07324
Nickel (Ni)7440-02-00.105113.000001.05381
subTotal3.50366100.0000035.12705
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.91318
FillerSilica fused60676-86-04.8840279.0000048.96626
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.71896
PigmentCarbon black1333-86-40.012360.200000.12397
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.47930
Non hazardousProprietary0.253474.100002.54129
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.23965
subTotal6.18230100.0000061.98261
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03096
Nickel (Ni)7440-02-00.0950292.300000.95268
Palladium (Pd)7440-05-30.003193.100000.03200
Silver (Ag)7440-22-40.001651.600000.01651
subTotal0.10295100.000001.03215
WirePure metalCopper (Cu)7440-50-80.02633100.000000.26396
subTotal0.02633100.000000.26396
total9.97425100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.