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Chemical content 74AHC30D

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Type numberPackagePackage descriptionTotal product weight
74AHC30DSOT108-1SO14136.08683 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352641861181312601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.47149
PolymerResin systemProprietary0.4975019.900000.36558
subTotal2.50000100.000001.83707
DieDoped siliconSilicon (Si)7440-21-30.21906100.000000.16097
subTotal0.21906100.000000.16097
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-863.3555097.4700046.55520
Iron (Fe)7439-89-61.560002.400001.14633
Phosphorus (P)7723-14-00.019500.030000.01433
Zinc (Zn)7440-66-60.065000.100000.04776
subTotal65.00000100.0000047.76362
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.34850
FillerSilica fused60676-86-053.7200079.0000039.47480
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.99809
PigmentCarbon black1333-86-40.136000.200000.09994
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.99872
Non hazardousProprietary2.788004.100002.04869
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.99936
subTotal68.00000100.0000049.96810
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00220
Nickel (Ni)7440-02-00.2910097.000000.21383
Palladium (Pd)7440-05-30.006002.000000.00441
subTotal0.30000100.000000.22044
WirePure metalCopper (Cu)7440-50-80.06777100.000000.04980
subTotal0.06777100.000000.04980
total136.08683100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.