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Chemical content 74AHC30GU12

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Type numberPackagePackage descriptionTotal product weight
74AHC30GU12SOT1174-1XQFN124.27974 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353060681151112601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0173860.000000.40601
ImpurityNon hazardousProprietary0.000010.039500.00027
PolymerResin systemProprietary0.0115739.951410.27034
subTotal0.02896100.000000.67662
DieDoped siliconSilicon (Si)7440-21-30.07824100.000001.82805
subTotal0.07824100.000001.82805
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.1318697.0000049.81275
Nickel (Ni)7440-02-00.065933.000001.54060
subTotal2.19779100.0000051.35335
Mould CompoundAdditiveNon hazardousProprietary0.052062.900001.21641
FillerSilica fused60676-86-01.5967888.9500037.31014
PigmentCarbon black1333-86-40.002690.150000.06292
PolymerEpoxy resin systemProprietary0.026391.470000.61659
Phenolic resinProprietary0.055833.110001.30449
Tetramethylbiphenyl diglycidyl ether85954-11-60.061393.420001.43452
subTotal1.79514100.0000041.94507
Pre-PlatingPure metal layerGold (Au)7440-57-50.001181.000000.02760
Nickel (Ni)7440-02-00.1074891.000002.51137
Palladium (Pd)7440-05-30.009458.000000.22078
subTotal0.11811100.000002.75975
WirePure metalGold (Au)7440-57-50.0608899.000001.42263
Palladium (Pd)7440-05-30.000621.000000.01437
subTotal0.06150100.000001.43700
total4.27974100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.