Chemical content 74AHC30PW

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Type numberPackagePackage descriptionTotal product weight
74AHC30PWSOT402-1TSSOP1456.17966 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352641871181112601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.5126480.100000.91250
PolymerResin systemProprietary0.1273619.900000.22670
DieDoped siliconSilicon (Si)7440-21-30.21906100.000000.38993
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-820.4687097.4700036.43436
Iron (Fe)7439-89-60.504002.400000.89712
Phosphorus (P)7723-14-00.006300.030000.01121
Zinc (Zn)7440-66-60.021000.100000.03738
Mould CompoundAdditiveNon hazardousProprietary1.593304.700002.83608
FillerSilica fused60676-86-026.7810079.0000047.67028
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.034006.000003.62053
PigmentCarbon black1333-86-40.067800.200000.12068
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.356004.000002.41368
Non hazardousProprietary1.389904.100002.47403
Tetramethylbiphenyl diglycidyl ether85954-11-60.678002.000001.20684
Pre-PlatingPure metal layerGold (Au)7440-57-50.003501.000000.00623
Nickel (Ni)7440-02-00.3395097.000000.60431
Palladium (Pd)7440-05-30.007002.000000.01246
WirePure metalCopper (Cu)7440-50-80.07060100.000000.12566
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.