Chemical content 74AHC32BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC32BQ-Q100SOT762-1DHVQFN1418.03352 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300191115312601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10331
PolymerResin systemProprietary0.0046319.900000.02567
DieDoped siliconSilicon (Si)7440-21-30.28449100.000001.57758
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8028397.4700037.72326
Iron (Fe)7439-89-60.167512.400000.92886
Phosphorus (P)7723-14-00.002090.030000.01161
Zinc (Zn)7440-66-60.006980.100000.03870
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.69757
FillerSilica -amorphous-7631-86-90.367153.490002.03592
Silica fused60676-86-08.9230784.8200049.48048
PigmentCarbon black1333-86-40.016830.160000.09334
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63003
Epoxy resin systemProprietary0.167271.590000.92754
Phenolic resinProprietary0.236702.250001.31256
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.15843
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00983
Nickel (Ni)7440-02-00.1612391.000000.89408
Palladium (Pd)7440-05-30.014178.000000.07860
WirePure metalCopper (Cu)7440-50-80.0474796.550000.26324
Pure metal layerGold (Au)7440-57-50.000170.350000.00095
Palladium (Pd)7440-05-30.001523.100000.00845
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.