Chemical content 74AHC373D

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Type number	Package	Package description	Total product weight
74AHC373D	SOT163-1	SO20	511.68602 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
935262651118	10	1	260		1	235			Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	10.41300	80.10000	2.03504
	Polymer	Resin system	Proprietary	2.58700	19.90000	0.50558
		subTotal		13.00000	100.00000	2.54062

Die	Doped silicon	Silicon (Si)	7440-21-3	0.36045	100.00000	0.07044
		subTotal		0.36045	100.00000	0.07044

Lead Frame Material	Copper alloy	Copper (Cu)	7440-50-8	151.07850	97.47000	29.52563
		Iron (Fe)	7439-89-6	3.72000	2.40000	0.72701
		Phosphorus (P)	7723-14-0	0.04650	0.03000	0.00909
		Zinc (Zn)	7440-66-6	0.15500	0.10000	0.03029
		subTotal		155.00000	100.00000	30.29202

Mould Compound	Additive	Non hazardous	Proprietary	15.98000	4.70000	3.12301
	Filler	Silica fused	60676-86-0	268.60000	79.00000	52.49313
	Flame retardant	Magnesium Hydroxide (Mg(OH)2)	1309-42-8	20.40000	6.00000	3.98682
	Pigment	Carbon black	1333-86-4	0.68000	0.20000	0.13289
	Polymer	1,4-Bis(methoxymethyl)benzene/phenol copolymer	26834-02-6	13.60000	4.00000	2.65788
		Non hazardous	Proprietary	13.94000	4.10000	2.72433
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	6.80000	2.00000	1.32894
		subTotal		340.00000	100.00000	66.44700

Pre-Plating	Pure metal layer	Gold (Au)	7440-57-5	0.03200	1.00000	0.00625
		Nickel (Ni)	7440-02-0	3.10400	97.00000	0.60662
		Palladium (Pd)	7440-05-3	0.06400	2.00000	0.01251
		subTotal		3.20000	100.00000	0.62538

Wire	Pure metal	Copper (Cu)	7440-50-8	0.12557	100.00000	0.02454
		subTotal		0.12557	100.00000	0.02454

		total		511.68602	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.