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Chemical content 74AHC374PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC374PW-Q100SOT360-1TSSOP2083.36033 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301203118612601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.03738
PolymerAcrylic resinProprietary0.0060815.200000.00729
Resin systemProprietary0.002766.900000.00331
subTotal0.04000100.000000.04798
DieDoped siliconSilicon (Si)7440-21-30.36045100.000000.43240
subTotal0.36045100.000000.43240
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.7946697.4700035.74201
Iron (Fe)7439-89-60.733632.400000.88007
Phosphorus (P)7723-14-00.009170.030000.01100
Zinc (Zn)7440-66-60.030570.100000.03667
subTotal30.56803100.0000036.66975
Mould CompoundAdditiveNon hazardousProprietary2.419564.700002.90253
FillerSilica fused60676-86-040.6692079.0000048.78723
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.088806.000003.70536
PigmentCarbon black1333-86-40.102960.200000.12351
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.059204.000002.47024
Non hazardousProprietary2.110684.100002.53200
Tetramethylbiphenyl diglycidyl ether85954-11-61.029602.000001.23512
subTotal51.48000100.0000061.75599
Pre-PlatingPure metal layerGold (Au)7440-57-50.023283.000000.02793
Nickel (Ni)7440-02-00.7162192.300000.85917
Palladium (Pd)7440-05-30.024053.100000.02886
Silver (Ag)7440-22-40.012421.600000.01489
subTotal0.77596100.000000.93085
WirePure metalCopper (Cu)7440-50-80.13589100.000000.16301
subTotal0.13589100.000000.16301
total83.36033100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.