Chemical content 74AHC594PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC594PW-Q100SOT403-1TSSOP1660.57585 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298654118812601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21862
PolymerAcrylic resinProprietary0.0258415.200000.04266
Resin systemProprietary0.011736.900000.01936
DieDoped siliconSilicon (Si)7440-21-30.38781100.000000.64020
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.88263
Iron (Fe)7439-89-60.475552.400000.78504
Phosphorus (P)7723-14-00.005940.030000.00981
Zinc (Zn)7440-66-60.019810.100000.03271
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39224
Silica fused60676-86-031.0186878.3300051.20635
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.98773
PigmentCarbon black1333-86-40.079200.200000.13075
PolymerEpoxy resin systemProprietary3.509358.862005.79332
Phenolic resinProprietary2.339575.908003.86221
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02491
Nickel (Ni)7440-02-00.4642592.300000.76640
Palladium (Pd)7440-05-30.015593.100000.02574
Silver (Ag)7440-22-40.008051.600000.01329
WirePure metalCopper (Cu)7440-50-80.10059100.000000.16605
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.