Chemical content 74AHC595D-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC595D-Q100SOT109-1SO16144.47971 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298632118612601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.8569077.900000.59309
PolymerAcrylic resinProprietary0.1672015.200000.11573
Resin systemProprietary0.075906.900000.05253
DieDoped siliconSilicon (Si)7440-21-30.59059100.000000.40877
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-850.6844097.4700035.08064
Iron (Fe)7439-89-61.248002.400000.86379
Phosphorus (P)7723-14-00.015600.030000.01080
Zinc (Zn)7440-66-60.052000.100000.03599
Mould CompoundAdditiveNon hazardousProprietary4.252094.700002.94304
FillerSilica fused60676-86-071.4713079.0000049.46805
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.428206.000003.75707
PigmentCarbon black1333-86-40.180940.200000.12524
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.618804.000002.50471
Non hazardousProprietary3.709274.100002.56733
Tetramethylbiphenyl diglycidyl ether85954-11-61.809402.000001.25236
Pre-PlatingPure metal layerGold (Au)7440-57-50.006003.000000.00415
Nickel (Ni)7440-02-00.1846092.300000.12777
Palladium (Pd)7440-05-30.006203.100000.00429
Silver (Ag)7440-22-40.003201.600000.00221
WirePure metalCopper (Cu)7440-50-80.11913100.000000.08245
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.