Chemical content 74AHC595D

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Type numberPackagePackage descriptionTotal product weight
74AHC595DSOT109-1SO16142.82478 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352655671181712601235Suzhou, China; Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01636
PolymerAcrylic resinProprietary0.0045615.200000.00319
Resin systemProprietary0.002076.900000.00145
DieDoped siliconSilicon (Si)7440-21-30.17725100.000000.12410
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-836.7218297.4700025.71110
Iron (Fe)7439-89-60.904202.400000.63308
Phosphorus (P)7723-14-00.011300.030000.00791
Zinc (Zn)7440-66-60.037680.100000.02638
Mould CompoundAdditiveNon hazardousProprietary4.900694.700003.43126
FillerSilica fused60676-86-082.3733079.0000057.67438
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.256206.000004.38033
PigmentCarbon black1333-86-40.208540.200000.14601
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.170804.000002.92022
Non hazardousProprietary4.275074.100002.99323
Tetramethylbiphenyl diglycidyl ether85954-11-62.085402.000001.46011
Pre-PlatingPure metal layerGold (Au)7440-57-50.005651.000000.00396
Nickel (Ni)7440-02-00.5480597.000000.38372
Palladium (Pd)7440-05-30.011302.000000.00791
WirePure metalCopper (Cu)7440-50-80.10753100.000000.07529
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.