Chemical content 74AHC595PW

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Type numberPackagePackage descriptionTotal product weight
74AHC595PWSOT403-1TSSOP1652.81178 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352655681181612601235Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.22126
PolymerAcrylic resinProprietary0.0228015.200000.04317
Resin systemProprietary0.010356.900000.01960
DieDoped siliconSilicon (Si)7440-21-30.17725100.000000.33562
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.66892
Iron (Fe)7439-89-60.489842.400000.92752
Phosphorus (P)7723-14-00.006120.030000.01159
Zinc (Zn)7440-66-60.020410.100000.03865
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.81937
FillerSilica fused60676-86-025.0272079.0000047.38943
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.59920
PigmentCarbon black1333-86-40.063360.200000.11997
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.39946
Non hazardousProprietary1.298884.100002.45945
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.19973
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00568
Nickel (Ni)7440-02-00.2910097.000000.55101
Palladium (Pd)7440-05-30.006002.000000.01136
WirePure metalCopper (Cu)7440-50-80.09454100.000000.17901
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.