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Chemical content 74AHC74D-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC74D-Q100SOT108-1SO14141.64190 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300323118712601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01650
PolymerAcrylic resinProprietary0.0045615.200000.00322
Resin systemProprietary0.002076.900000.00146
subTotal0.03000100.000000.02118
DieDoped siliconSilicon (Si)7440-21-30.21203100.000000.14969
subTotal0.21203100.000000.14969
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.71039
Iron (Fe)7439-89-61.175702.400000.83005
Phosphorus (P)7723-14-00.014700.030000.01038
Zinc (Zn)7440-66-60.048990.100000.03459
subTotal48.98742100.0000034.58541
Mould CompoundAdditiveNon hazardousProprietary4.280974.700003.02239
FillerSilica fused60676-86-071.9567679.0000050.80188
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.465076.000003.85837
PigmentCarbon black1333-86-40.182170.200000.12861
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.643384.000002.57225
Non hazardousProprietary3.734464.100002.63655
Tetramethylbiphenyl diglycidyl ether85954-11-61.821692.000001.28612
subTotal91.08450100.0000064.30617
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02634
Nickel (Ni)7440-02-01.1477892.300000.81034
Palladium (Pd)7440-05-30.038553.100000.02722
Silver (Ag)7440-22-40.019901.600000.01405
subTotal1.24353100.000000.87795
WirePure metalCopper (Cu)7440-50-80.08442100.000000.05960
subTotal0.08442100.000000.05960
total141.64190100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.