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Chemical content 74AHC86BQ

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Type numberPackagePackage descriptionTotal product weight
74AHC86BQSOT762-1DHVQFN1417.85184 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855471151312601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0560780.100000.31409
PolymerResin systemProprietary0.0139319.900000.07803
subTotal0.07000100.000000.39212
DieDoped siliconSilicon (Si)7440-21-30.39829100.000002.23109
subTotal0.39829100.000002.23109
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.4622697.4700036.19941
Iron (Fe)7439-89-60.159122.400000.89134
Phosphorus (P)7723-14-00.001990.030000.01114
Zinc (Zn)7440-66-60.006630.100000.03714
subTotal6.63000100.0000037.13903
Mould CompoundFillerSilica -amorphous-7631-86-90.836307.980004.68469
Silica fused60676-86-08.3936480.0920047.01836
PigmentCarbon black1333-86-40.097250.928000.54479
PolymerEpoxy resin systemProprietary0.885568.450004.96061
Phenolic resinProprietary0.267242.550001.49699
subTotal10.48000100.0000058.70544
Pre-PlatingPure metal layerGold (Au)7440-57-50.006603.000000.03697
Nickel (Ni)7440-02-00.2030692.300001.13747
Palladium (Pd)7440-05-30.006823.100000.03820
Silver (Ag)7440-22-40.003521.600000.01972
subTotal0.22000100.000001.23236
WirePure metalCopper (Cu)7440-50-80.05355100.000000.29997
subTotal0.05355100.000000.29997
total17.85184100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.