Chemical content 74AHC86PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC86PW-Q100SOT402-1TSSOP1456.01437 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301398118612601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4985677.900000.89006
PolymerAcrylic resinProprietary0.0972815.200000.17367
Resin systemProprietary0.044166.900000.07884
DieDoped siliconSilicon (Si)7440-21-30.39829100.000000.71105
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-820.4687097.4700036.54187
Iron (Fe)7439-89-60.504002.400000.89977
Phosphorus (P)7723-14-00.006300.030000.01125
Zinc (Zn)7440-66-60.021000.100000.03749
Mould CompoundAdditiveNon hazardousProprietary1.584374.700002.82851
FillerSilica fused60676-86-026.6309079.0000047.54298
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.022606.000003.61086
PigmentCarbon black1333-86-40.067420.200000.12036
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.348404.000002.40724
Non hazardousProprietary1.382114.100002.46742
Tetramethylbiphenyl diglycidyl ether85954-11-60.674202.000001.20362
Pre-PlatingPure metal layerGold (Au)7440-57-50.005103.000000.00910
Nickel (Ni)7440-02-00.1569192.300000.28012
Palladium (Pd)7440-05-30.005273.100000.00941
Silver (Ag)7440-22-40.002721.600000.00486
WirePure metalCopper (Cu)7440-50-80.09608100.000000.17153
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.