Chemical content 74AHCT02D-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT02D-Q100SOT108-1SO14141.82490 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300972118712601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01648
PolymerAcrylic resinProprietary0.0045615.200000.00322
Resin systemProprietary0.002076.900000.00146
DieDoped siliconSilicon (Si)7440-21-30.39829100.000000.28083
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.66689
Iron (Fe)7439-89-61.175702.400000.82898
Phosphorus (P)7723-14-00.014700.030000.01036
Zinc (Zn)7440-66-60.048990.100000.03454
Mould CompoundAdditiveNon hazardousProprietary4.280974.700003.01849
FillerSilica fused60676-86-071.9567679.0000050.73633
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.465076.000003.85339
PigmentCarbon black1333-86-40.182170.200000.12845
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.643384.000002.56893
Non hazardousProprietary3.734464.100002.63315
Tetramethylbiphenyl diglycidyl ether85954-11-61.821692.000001.28446
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02630
Nickel (Ni)7440-02-01.1477892.300000.80929
Palladium (Pd)7440-05-30.038553.100000.02718
Silver (Ag)7440-22-40.019901.600000.01403
WirePure metalCopper (Cu)7440-50-80.08116100.000000.05723
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.