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Chemical content 74AHCT02PW

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Type numberPackagePackage descriptionTotal product weight
74AHCT02PWSOT402-1TSSOP1452.01144 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352626911181212601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.05991
PolymerAcrylic resinProprietary0.0060815.200000.01169
Resin systemProprietary0.002766.900000.00531
subTotal0.04000100.000000.07691
DieDoped siliconSilicon (Si)7440-21-30.39829100.000000.76577
subTotal0.39829100.000000.76577
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.61817
Iron (Fe)7439-89-60.468962.400000.90165
Phosphorus (P)7723-14-00.005860.030000.01127
Zinc (Zn)7440-66-60.019540.100000.03757
subTotal19.54000100.0000037.56866
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.86275
FillerSilica fused60676-86-025.0272079.0000048.11864
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.65458
PigmentCarbon black1333-86-40.063360.200000.12182
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.43639
Non hazardousProprietary1.298884.100002.49730
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.21819
subTotal31.68000100.0000060.90967
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00558
Nickel (Ni)7440-02-00.2813097.000000.54084
Palladium (Pd)7440-05-30.005802.000000.01115
subTotal0.29000100.000000.55757
WirePure metalCopper (Cu)7440-50-80.06315100.000000.12141
subTotal0.06315100.000000.12141
total52.01144100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.