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Chemical content 74AHCT08PW

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Type numberPackagePackage descriptionTotal product weight
74AHCT08PWSOT402-1TSSOP1456.19299 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352626771181512601235Shanghai, China; Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.5126480.100000.91228
PolymerResin systemProprietary0.1273619.900000.22665
subTotal0.64000100.000001.13893
DieDoped siliconSilicon (Si)7440-21-30.21155100.000000.37646
subTotal0.21155100.000000.37646
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-820.4687097.4700036.42572
Iron (Fe)7439-89-60.504002.400000.89691
Phosphorus (P)7723-14-00.006300.030000.01121
Zinc (Zn)7440-66-60.021000.100000.03737
subTotal21.00000100.0000037.37121
Mould CompoundAdditiveNon hazardousProprietary1.593304.700002.83541
FillerSilica fused60676-86-026.7810079.0000047.65897
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.034006.000003.61967
PigmentCarbon black1333-86-40.067800.200000.12066
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.356004.000002.41311
Non hazardousProprietary1.389904.100002.47344
Tetramethylbiphenyl diglycidyl ether85954-11-60.678002.000001.20656
subTotal33.90000100.0000060.32782
Pre-PlatingPure metal layerGold (Au)7440-57-50.003501.000000.00623
Nickel (Ni)7440-02-00.3395097.000000.60417
Palladium (Pd)7440-05-30.007002.000000.01246
subTotal0.35000100.000000.62286
WirePure metalCopper (Cu)7440-50-80.09145100.000000.16274
subTotal0.09145100.000000.16274
total56.19299100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.