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Chemical content 74AHCT123ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT123ABQ-Q100SOT763-1DHVQFN1621.23166 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300988115412601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0720980.100000.33954
PolymerResin systemProprietary0.0179119.900000.08436
subTotal0.09000100.000000.42390
DieDoped siliconSilicon (Si)7440-21-30.32886100.000001.54891
subTotal0.32886100.000001.54891
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.7196297.4700036.35902
Iron (Fe)7439-89-60.190082.400000.89527
Phosphorus (P)7723-14-00.002380.030000.01119
Zinc (Zn)7440-66-60.007920.100000.03730
subTotal7.92000100.0000037.30278
Mould CompoundFillerSilica -amorphous-7631-86-91.001497.980004.71697
Silica fused60676-86-010.0515580.0920047.34225
PigmentCarbon black1333-86-40.116460.928000.54854
PolymerEpoxy resin systemProprietary1.060488.450004.99478
Phenolic resinProprietary0.320022.550001.50730
subTotal12.55000100.0000059.10984
Pre-PlatingPure metal layerGold (Au)7440-57-50.008103.000000.03815
Nickel (Ni)7440-02-00.2492192.300001.17377
Palladium (Pd)7440-05-30.008373.100000.03942
Silver (Ag)7440-22-40.004321.600000.02035
subTotal0.27000100.000001.27169
WirePure metalCopper (Cu)7440-50-80.07280100.000000.34289
subTotal0.07280100.000000.34289
total21.23166100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.