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Chemical content 74AHCT123APW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT123APW-Q100SOT403-1TSSOP1660.43682 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300987118512601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21912
PolymerAcrylic resinProprietary0.0258415.200000.04276
Resin systemProprietary0.011736.900000.01941
subTotal0.17000100.000000.28129
DieDoped siliconSilicon (Si)7440-21-30.23490100.000000.38867
subTotal0.23490100.000000.38867
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.95597
Iron (Fe)7439-89-60.475552.400000.78685
Phosphorus (P)7723-14-00.005940.030000.00984
Zinc (Zn)7440-66-60.019810.100000.03279
subTotal19.81448100.0000032.78545
Mould CompoundAdditiveNon hazardousProprietary1.861204.700003.07958
FillerSilica fused60676-86-031.2840079.0000051.76315
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.376006.000003.93138
PigmentCarbon black1333-86-40.079200.200000.13105
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.584004.000002.62092
Non hazardousProprietary1.623604.100002.68644
Tetramethylbiphenyl diglycidyl ether85954-11-60.792002.000001.31046
subTotal39.60000100.0000065.52298
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02497
Nickel (Ni)7440-02-00.4642592.300000.76816
Palladium (Pd)7440-05-30.015593.100000.02580
Silver (Ag)7440-22-40.008051.600000.01332
subTotal0.50298100.000000.83225
WirePure metalCopper (Cu)7440-50-80.11446100.000000.18938
subTotal0.11446100.000000.18938
total60.43682100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.