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Chemical content 74AHCT125BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT125BQ-Q100SOT762-1DHVQFN1417.74456 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298426115512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0560780.100000.31598
PolymerResin systemProprietary0.0139319.900000.07850
subTotal0.07000100.000000.39448
DieDoped siliconSilicon (Si)7440-21-30.39829100.000002.24458
subTotal0.39829100.000002.24458
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.3550497.4700035.81404
Iron (Fe)7439-89-60.156482.400000.88185
Phosphorus (P)7723-14-00.001960.030000.01102
Zinc (Zn)7440-66-60.006520.100000.03674
subTotal6.52000100.0000036.74365
Mould CompoundFillerSilica -amorphous-7631-86-90.836307.980004.71302
Silica fused60676-86-08.3936480.0920047.30262
PigmentCarbon black1333-86-40.097250.928000.54808
PolymerEpoxy resin systemProprietary0.885568.450004.99060
Phenolic resinProprietary0.267242.550001.50604
subTotal10.48000100.0000059.06036
Pre-PlatingPure metal layerGold (Au)7440-57-50.006603.000000.03719
Nickel (Ni)7440-02-00.2030692.300001.14435
Palladium (Pd)7440-05-30.006823.100000.03843
Silver (Ag)7440-22-40.003521.600000.01984
subTotal0.22000100.000001.23981
WirePure metalCopper (Cu)7440-50-80.05627100.000000.31711
subTotal0.05627100.000000.31711
total17.74456100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.