Chemical content 74AHCT125BQ

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Type numberPackagePackage descriptionTotal product weight
74AHCT125BQSOT762-1DHVQFN1421.77090 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352855431151612601235Shanghai, China; Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43415
PolymerResin systemProprietary0.0234819.900000.10786
DieDoped siliconSilicon (Si)7440-21-30.15110100.000000.69407
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.70617
Iron (Fe)7439-89-60.205522.346100.94400
Phosphorus (P)7723-14-00.002650.030200.01215
Zinc (Zn)7440-66-60.008890.101500.04084
Pure metal layerGold (Au)7440-57-50.002650.030200.01215
Nickel (Ni)7440-02-00.106921.220500.49109
Palladium (Pd)7440-05-30.004910.056000.02253
Silver (Ag)7440-22-40.001800.020500.00825
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69567
FillerSilica -amorphous-7631-86-90.442743.490002.03364
Silica fused60676-86-010.7602784.8200049.42499
PigmentCarbon black1333-86-40.020300.160000.09323
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62932
Epoxy resin systemProprietary0.201711.590000.92650
Phenolic resinProprietary0.285442.250001.31108
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15601
WirePure metalCopper (Cu)7440-50-80.0538796.550000.24744
Pure metal layerGold (Au)7440-57-50.000200.350000.00090
Palladium (Pd)7440-05-30.001733.100000.00794
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.