Chemical content 74AHCT125D

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Type numberPackagePackage descriptionTotal product weight
74AHCT125DSOT108-1SO14136.03887 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352627641182112601235Shanghai, China; Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.47201
PolymerResin systemProprietary0.4975019.900000.36570
DieDoped siliconSilicon (Si)7440-21-30.15110100.000000.11107
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-863.3555097.4700046.57162
Iron (Fe)7439-89-61.560002.400001.14673
Phosphorus (P)7723-14-00.019500.030000.01433
Zinc (Zn)7440-66-60.065000.100000.04778
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.34933
FillerSilica fused60676-86-053.7200079.0000039.48871
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.99914
PigmentCarbon black1333-86-40.136000.200000.09997
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.99943
Non hazardousProprietary2.788004.100002.04941
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.99971
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00221
Nickel (Ni)7440-02-00.2910097.000000.21391
Palladium (Pd)7440-05-30.006002.000000.00441
WirePure metalCopper (Cu)7440-50-80.08776100.000000.06451
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.