Chemical content 74AHCT132BQ

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Type numberPackagePackage descriptionTotal product weight
74AHCT132BQSOT762-1DHVQFN1418.03356 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352788061151412601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10331
PolymerResin systemProprietary0.0046319.900000.02567
DieDoped siliconSilicon (Si)7440-21-30.28449100.000001.57758
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.72396
Iron (Fe)7439-89-60.167512.400000.92888
Phosphorus (P)7723-14-00.002090.030000.01161
Zinc (Zn)7440-66-60.006980.100000.03870
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.69757
FillerSilica -amorphous-7631-86-90.367153.490002.03592
Silica fused60676-86-08.9230684.8200049.48032
PigmentCarbon black1333-86-40.016830.160000.09334
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63003
Epoxy resin systemProprietary0.167271.590000.92754
Phenolic resinProprietary0.236702.250001.31255
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.15842
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00982
Nickel (Ni)7440-02-00.1612391.000000.89406
Palladium (Pd)7440-05-30.014178.000000.07860
WirePure metalCopper (Cu)7440-50-80.0473996.550000.26276
Pure metal layerGold (Au)7440-57-50.000170.350000.00095
Palladium (Pd)7440-05-30.001523.100000.00844
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.