Chemical content 74AHCT132D

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Type numberPackagePackage descriptionTotal product weight
74AHCT132DSOT108-1SO14124.27945 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352629951181112601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.6408080.100000.51561
PolymerResin systemProprietary0.1592019.900000.12810
DieDoped siliconSilicon (Si)7440-21-30.39829100.000000.32048
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.5653697.4700038.27291
Iron (Fe)7439-89-61.171202.400000.94239
Phosphorus (P)7723-14-00.014640.030000.01178
Zinc (Zn)7440-66-60.048800.100000.03927
Mould CompoundAdditiveNon hazardousProprietary3.478004.700002.79853
FillerSilica fused60676-86-058.4600079.0000047.03915
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.440006.000003.57259
PigmentCarbon black1333-86-40.148000.200000.11909
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.960004.000002.38173
Non hazardousProprietary3.034004.100002.44127
Tetramethylbiphenyl diglycidyl ether85954-11-61.480002.000001.19086
Pre-PlatingPure metal layerGold (Au)7440-57-50.002001.000000.00161
Nickel (Ni)7440-02-00.1940097.000000.15610
Palladium (Pd)7440-05-30.004002.000000.00322
WirePure metalCopper (Cu)7440-50-80.08116100.000000.06531
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.