Chemical content 74AHCT132PW

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Type numberPackagePackage descriptionTotal product weight
74AHCT132PWSOT402-1TSSOP1451.91962 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352629961181212601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.06002
PolymerAcrylic resinProprietary0.0060815.200000.01171
Resin systemProprietary0.002766.900000.00532
DieDoped siliconSilicon (Si)7440-21-30.28449100.000000.54795
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.68293
Iron (Fe)7439-89-60.468962.400000.90324
Phosphorus (P)7723-14-00.005860.030000.01129
Zinc (Zn)7440-66-60.019540.100000.03764
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.86782
FillerSilica fused60676-86-025.0272079.0000048.20374
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.66104
PigmentCarbon black1333-86-40.063360.200000.12203
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.44070
Non hazardousProprietary1.298884.100002.50171
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.22035
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00559
Nickel (Ni)7440-02-00.2813097.000000.54180
Palladium (Pd)7440-05-30.005802.000000.01117
WirePure metalCopper (Cu)7440-50-80.08513100.000000.16397
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.